現在位置首頁 > 會議論文 > 詳目
  • 全文下載
主要題名:A novel high coplanarity lead free copper pillar bump fabrication process
作者姓名:Hsu, Hou-JunTsai, Ting-ChiangWu, Rung-GenLee, Kuo-YuHuang, Jung-Tang
中文關鍵詞:copper pillarhigh coplanaritylead-free
摘要:In this paper, we report a novel plating-friendly polishing mechanism for fabrication of high coplanarity and high density lead-free copper pillar bumps for advanced packaging applications. The final experimental results showed that the UIW (Uniformity in Wafer) could be sharply decreased from 6.37% after plating to 1.7% after polishing and even to 1.7% after reflow throughout the entire 4 inch wafer.
貢獻者資料:機電學院/機電科技研究所
論文ID:10623-me-pc-2009-06-2_1p
典藏單位:國立臺北科技大學
數位物件檔名:10623-me-pc-2009-06-2_1p.pdf
發行日期:2009-06
統一資源識別號:http://dx.doi.org/10.1109/IITC.2009.5090377
註:©2009 IEEE
資料開放狀態:開放
研討會:Interconnect Technology Conference, 2009. IITC 2009. IEEE International, 1-3 June 2009, Sapporo, Japan
論文起迄頁碼:pp169 - 170